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TLP2098 2009-09-10 1 toshiba photocoupler gaa ? as ired & photo-ic TLP2098 programmable controllers high-speed digital interfaces data transmission between circuits with dif ferent voltage potential the toshiba TLP2098 consists of two gaa ? as infrared light emitting diode optically coupled to a high-gain, high-speed photodetector. the TLP2098 is housed in a 6-pin mfsop. the TLP2098 has an internal faraday shield, which provides a guaranteed common-mode transient immunity of 15 kv/ s. the TLP2098 has an inverting output. a non-inverting output version, the tlp2095, is also available. z inverter logic type (totem-pole output) z guaranteed performance over temperature: -40 to 100c z power supply voltage: 3.0 to 20 v z input threshold current: i fhl = 3 ma (max) z switching time (t plh /t phl ): 250 ns (max) z common mode transient immunity: 15 kv/ s z isolation voltage: 3750 vrms truth table input led tr1 tr2 output h on off on l l off on off h jedec D jeita D toshiba 11-4c2 weight: 0.09 g (typ.) unit in mm v cc gnd shield 1 3 4 5 6 v cc v o gnd i cc i o 6 5 4 shield 3 1 i f1 tr1 tr2 v f i f2 pin configuration (top view) 1 : anode cathode 3 : cathode anode 4 : gnd 5 : output 6 : vcc schematic 0.1 f bypass capacitor must be connected between pin 6 and 4
TLP2098 2009-09-10 2 recommended operating conditions characteristic symbol min typ. max unit input current , on i f(on) 5 D 15 ma input voltage , off v f(off) 0 D 0.8 v supply voltage* v cc 3.0 D 20 v operating temperature t opr -40 D 100 c * this item denotes operating range, not meaning of recommended operating conditions. note: recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guide line respectively. in developing designs using this product, please confirm specified characteristics shown in this document. absolute maximum ratings (ta = 25c) characteristic symbol rating unit forward current i f 20 ma forward current derating (ta 83 ) ? i f / ? c -0.48 ma/ ? c led peak transient forward current (note1) i fpt 1 a output current 1 (ta 25) i o1 25/-15 ma output current 2 (ta 100 ) i o2 5/-5 ma output voltage v o -0.5 to 20 v detector supply voltage v cc -0.5 to 20 v operating temperature range t opr -40 to 100 c storage temperature range t stg -55 to 125 c lead solder temperature (10s) t sol 260 c isolation voltage (ac,1min.,r.h. 60%,ta=25 c) (note 2) bv s 3750 v rms note: using continuously under heavy loads (e.g. the a pplication of high temperature/current/voltage and the significant change in temperature, et c.) may cause this product to decreas e in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: pulse width 1 s, 300pps. note 2: device considered a two terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted together.
TLP2098 2009-09-10 3 electrical characteristics (unless otherwise specifi ed, t a = -40 to 100 c,v cc = 3.0 to 20 v) characteristic symbol test circuit condition min typ. max unit input forward voltage v f D i f = 10 ma , ta = 25 c 1.45 1.57 1.75 v temperature coefficient of forward voltage v f / ta D i f = 10 ma D -2.0 D mv/ c input capacitance c t D v = 0, f = 1 mhz , ta = 25 c D 190 D pf logic low output voltage v ol 1 i ol = 0.02 ma, i f = 5 ma D 0.2 0.6 v v cc = 3.0 v 2.0 2.5 D logic high output voltage v oh 2 i oh = -0.02 ma, v f =0.8 v v cc = 20 v 17.4 19.5 D v logic low supply current i ccl 3 i f = 5 ma D D 3.0 ma logic high supply current i cch 4 v f = 0 v D D 3.0 ma v cc =v o =4.5 v 15 80 D logic low short circuit output current (note3) i osl 5 i f = 5 ma v cc =v o =20 v 20 90 D ma v cc =4.5 v -5 -12 D logic high short circuit output current (note3) i osh 6 v f = 0 v v o = gnd v cc =20 v -10 -20 D ma input current logic low output i fhl D i o = 0.02 ma, v o < 0.6 v D 1.0 3.0 ma input voltage logic high output v flh D i o = -0.02 ma, v o > 2.0 v 0.8 D D v input current hysteresis i hys D v cc = 5 v D 0.05 D ma * all typical values are at v cc =5v, ta=25 c note 3: duration of output short circuit time should not exceed 10 ms. note 4: a ceramic capacitor (0.1 a) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain linear amplifier. failure to provide the bypassing may impair the switching property. the total lead length between capacitor and coupler should not exceed 1 cm. isolation characteristics (ta = 25c) characteristic symbol test condition min typ. max unit capacitance input to output c s v s = 0, f = 1 mhz (note 2) D 0.8 D pf isolation resistance r s r.h. 60%, v s = 500 v (note 2) 110 12 10 14 D ac,1 minute 3750 D D ac,1 second,in oil D 10000 D v rms isolation voltage bv s dc,1 minute,in oil D 10000 D v dc
TLP2098 2009-09-10 4 switching characteristics (unless otherwise specifi ed, t a = -40 to 100 c,vcc = 3.0 to 20 v) characteristic symbol test circuit condition min typ. max unit propagation delay time to logic high output t plh i f = 5 0ma 30 150 250 ns propagation delay time to logic low output t phl i f = 0 5ma 30 150 250 ns switching time dispersion between on and off |t phl - t plh | D D D 220 ns rise time (10 ? 90 %) t r i f = 5 0 ma , v cc = 5 v D 30 75 ns fall time (90 ? 10 %) t f 7, 8 (note5) i f = 0 5 ma , v cc = 5 v D 30 75 ns common mode transient immunity at high level output cm h v cm = 1000v p-p , i f = 0 a, v cc = 20 v, ta = 25 c -15 D D kv/ s common mode transient immunity at low level output cm l 9 v cm = 1000v p-p , i f =5 ma, v cc = 20 v, ta = 25 c 15 D D kv/ s *all typical values are at ta = 25 c note5. v cc =4.5 to 20v at test circuit 7. test ci rcui t 1: v ol test ci rcui t 2: v oh test ci rcui t 3: i ccl test ci rcui t 4: i cch test ci rcui t 5: i osl test ci rcui t 6: i osh 0.1 f v ol v cc 6 5 4 v i ol v cc gnd shield 3 1 4 0.1 f v o 6 5 v i oh i f v cc v cc gnd shield 3 1 v cc 1 6 5 4 i ccl a 0.1 f v cc gnd shield 3 v cc 6 5 4 i cch a i f 0.1 f 1 v cc gnd shield 3 1 6 0.1 f v o v cc 3 5 4 i osl a v cc gnd shield v cc 0.1 f i f 1 3 6 5 4 i osh a v o v cc gnd shield *v oh = v cc -v o
TLP2098 2009-09-10 5 test circuit 7: switching time test circuit test circuit 8: switching time test circuit test circuit 9: common mode tr ansient immunity test circuit )( )(800 s t f v h cm = )( )(800 s t r v l cm = c l is approximately 15 pf which includes probe and stray wiring capacitance. p.g.: pulse generator i f v o v oh v ol t plh t phl 1.3v 50% t r t f 90% 10% i f =5ma (p.g) v cc gnd shield v o 0.1 f c l v cc i f i 5v 620 5k 1 3 6 5 4 i f =5ma (p.g) v cc i f v o 0.1 f c l 1 3 6 5 4 v cc gnd shield i f v o v oh v ol t plh t phl 1.3v 50% t r t f 90% 10% c l is approximately 15 pf which includes probe and stray wiring capacitance. p.g.: pulse generator ? sw b : i f =0ma 0.1 f v o v cc sw i f 1 3 6 5 4 v cm a b v cm 10% 90% 1000 cm l ? sw a : i f =5ma 17v v o t r t f v cc gnd shield cm h 1v (f=50 khz , duty=50%, less than tr=tf=5ns) (f=50 khz , duty=50%, less than tr=tf=5ns)
TLP2098 2009-09-10 6 soldering and storage 1. soldering 1.1 soldering when using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) using solder reflow temperature profile example of lead (pb) solder temperature profile example of using lead (pb)-free solder ? reflow soldering must be performed once or twice. ? the mounting should be completed with the interval fr om the first to the last mountings being 2 weeks. 2) using solder flow (for lead (pb) solder, or lead (pb)-free solder) ? please preheat it at 150c between 60 and 120 seconds. ? complete soldering within 10 seconds below 260c. each pin may be heated at most once. 3) using a soldering iron complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 to 120s less than 30s package surface temperature 140 time (s) (c) 260 230 190 60 to 120s 30 to 50s 180 package surface temperature this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
TLP2098 2009-09-10 7 2. storage 1) avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) follow the precautions printed on the packing label of the device for transportation and storage. 3) keep the storage location temperature and humid ity within a range of 5c to 35c and 45% to 75% respectively. 4) do not store the products in locations with poiso nous gases (especially corrosive gases) or in dusty conditions. 5) store the products in locations with minimal te mperature fluctuations. rapi d temperature changes during storage can cause condensation, resulting in lead ox idation or corrosion, which will deteriorate the solderability of the leads. 6) when restoring devices after removal from their packing, use anti-static containers. 7) do not allow loads to be applied direct ly to devices while they are in storage. 8) if devices have been stored for more than two years under normal stora ge conditions, it is recommended that you check the leads for ease of soldering prior to use.
TLP2098 2009-09-10 8 specification for embossed?tape packing (tpl)(tpr) for mini-flat coupler 1. applicable package 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. (example) TLP2098 (tpl, f) [[g]]/rohs compatible (note6) tape type device name 3. tape dimensions 3.1 specification classification are as shown in table 1 table 1 tape type classification tape type classification quantity (pcs / reel) tpl l direction 3000 tpr r direction 3000 3.2 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure 1 device orientation package product type mfsop mini-flat coupler direction of tape l direction r direction
TLP2098 2009-09-10 9 3.3 empty device recesses are as shown in table 2. table 2 empty device recesses 3.4 start and end of tape the start of the tape has 50 or more empty holes. the end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 3. figure 2 tape forms table 3 tape dimensions unit: mm unless otherwise specified: 0.1 symbol dimension remark a 4.2 D b 7.6 D d 5.5 centre line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 8.0 cumulative error (max) per 10 feed holes g 4.0 cumulative error (max) per 10 feed holes k 0 2.8 internal space standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 devices (max ) per reel not including leader and trailer 0.3 0.05 3.15 0.2 k 0 g f 1.6 0.1 a e d b 12.0 0.3 1.5 +0.1 ?0 +0.1 -0.3 +0.1 -0.3
TLP2098 2009-09-10 10 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 4. table 4 reel dimensions unit: mm figure 3 reel form 4. packing either one reel or five reels of photoc oupler are packed in a shipping carton. 5. label indication the carton bears a label indicating the product nu mber, the symbol representing classification of standard, the quantity, the lot num ber and the toshiba company name. 6. ordering method when placing an order, plea se specify the product number, the tape type and the quantity as shown in the following example. (example) (example) TLP2098 (tpl, f) 3000 pcs quantity (must be a multiple of 3000) [[g]]/rohs compatible (note 6) tape type device name note 6 : please contact your toshiba sales representative fo r details as to environmental matters such as the rohs compatibility of product. rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous subs tances in electrical and electronics equipment. symbol dimension a 380 2 b 801 c 130.5 e 2.00.5 u 4.00.5 w1 13.50.5 w2 17.51.0 e w1 w2 a b c u
TLP2098 2009-09-10 11 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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